Public tenders from EIS (eis.gov.lv) for Microelectronic machinery and apparatus and microsystems (CPV 31712000-0)

Latest tenders from Latvian Electronic Procurement System (Elektronisko iepirkumu sistēma, EIS - eis.gov.lv) matching CPV category Microelectronic machinery and apparatus and microsystems (31712000-0).

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Microelectronic machinery and apparatus and microsystems

Latest tenders for Microelectronic machinery and apparatus and microsystems

Tender

CPV

Published

Deadline

Info

LU Cietvielu fizikas institūts
www.eis.gov.lvLU CFI 2025/30/SP
Si3N4 integrētā fotoniskā shēma
Si3N4 integrētā fotoniskā shēma
CPV: 31712200-2 Microsystems
Published: 12/17/2025 12:00 AM · 7 months ago
Awarded
31712200-2Microsystems
12/17/202512:00 AM7 months ago
Awarded

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Latvia

Countries - Microelectronic machinery and apparatus and microsystems (CPV 31712000-0)

Estonia
Lithuania
Latvia
Poland

Sources in Latvia - Microelectronic machinery and apparatus and microsystems (CPV 31712000-0)

EIS (eis.gov.lv)

All CPV codes

Wider CPV codes - EIS (eis.gov.lv)

Electrical machinery, apparatus, equipment and consumables; lighting (CPV 31000000-6)
Electronic, electromechanical and electrotechnical supplies (CPV 31700000-3)
Electronic equipment (CPV 31710000-6)

Narrower CPV codes - EIS (eis.gov.lv)

Microelectronic machinery and apparatus (CPV 31712100-1)
Electronic integrated circuits and microassemblies (CPV 31712110-4)
Phone cards (CPV 31712111-1)
SIM cards (CPV 31712112-8)
Cards containing integrated circuits (CPV 31712113-5)
Integrated electronic circuits (CPV 31712114-2)
Microassemblies (CPV 31712115-9)
Microprocessors (CPV 31712116-6)
Integrated circuit packages (CPV 31712117-3)
Integrated circuit sockets or mounts (CPV 31712118-0)
Integrated circuit lids (CPV 31712119-7)
Microsystems (CPV 31712200-2)
Printed circuits (CPV 31712300-3)
Populated printed circuit boards (CPV 31712310-6)
Unpopulated printed circuit boards (CPV 31712320-9)
Semiconductors (CPV 31712330-2)
Photovoltaic cells (CPV 31712331-9)
Thyristors (CPV 31712332-6)
Diacs (CPV 31712333-3)
Triacs (CPV 31712334-0)
Optical coupled isolators (CPV 31712335-7)
Crystal oscillators (CPV 31712336-4)
Diodes (CPV 31712340-5)
Light-emitting diodes (CPV 31712341-2)
Microwave or small signal diodes (CPV 31712342-9)
Zener diodes (CPV 31712343-6)
Schottky diodes (CPV 31712344-3)
Tunnel diodes (CPV 31712345-0)
Photosensitive diodes (CPV 31712346-7)
Power or solar diodes (CPV 31712347-4)
Laser diodes (CPV 31712348-1)
Radio frequency (RF) diodes (CPV 31712349-8)
Transistors (CPV 31712350-8)
Photo sensitive transistors (CPV 31712351-5)
Field effect transistors (FET) (CPV 31712352-2)
Metal oxide field effect transistors (MOSFET) (CPV 31712353-9)
Transistor chips (CPV 31712354-6)
Bipolar darlington or radio frequency (RF) transistors (CPV 31712355-3)
Unijunction transistors (CPV 31712356-0)
Insulated gate bipolar transistors (IGBT) (CPV 31712357-7)
Junction field effect transistors (JFET) (CPV 31712358-4)
Bipolar junction transistors (BJT) (CPV 31712359-1)
Mounted piezo-electric crystals (CPV 31712360-1)

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Latest tenders for Microelectronic machinery and apparatus and microsystems

Si3N4 integrētā fotoniskā shēma